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COMPLEX HEAT EVACUATION
Project type
Solving Complex Engineering Problem
The first generation of the head-mounted device faced issues with elevated temperatures within its System-on-Module and on the surface near the user's head. This made the device uncomfortable to use and pushed it to the limits of its operational temperature range, potentially affecting its performance.
For the second generation, I was tasked with advising on effective methods to reduce these temperatures without increasing the size or weight of the device. After conducting a thorough thermal analysis and evaluating various alternatives, I proposed a series of measures that resulted in a more than 15°C temperature reduction, as verified by testing. This outcome validated our comprehensive approach and significantly improved the device’s usability and performance.
